Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO Buffer/Switch
Reduced-Power Mode
Each channel of the device has two pins (LO_ADJ__,
IF__SET) that allow external resistors to set the internal
bias currents. Nominal values for these resistors are
given in Table 1. Larger value resistors can be used to
reduce power dissipation at the expense of some per-
formance loss. If ±1% resistors are not readily available,
substitute with ±5% resistors.
Significant reductions in power consumption can also
be realized by operating the mixer with an optional 3.3V
supply voltage. Doing so reduces the overall power con-
sumption by approximately 47%. See the 3.3V Supply
AC Electrical Characteristics table and the relevant 3.3V
curves in the Typical Operating Characteristics section.
IND_EXT_ Inductors
For applications requiring optimum RF-to-IF and LO-to-
IF isolation, connect low-ESR inductors from IND_EXT_
(pins 15 and 31) to ground. When improved isolation
is not required, connect IND_EXT_ to ground using 0 I
resistance.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
The load impedance presented to the mixer must be
such that any capacitance from both IF_- and IF_+ to
Table 1. Component Values
ground does not exceed several picofarads. For the
best performance, route the ground pin traces directly
to the exposed pad under the package. The PCB
exposed pad MUST be connected to the ground plane
of the PCB. Use multiple vias to connect this pad to the
lower-level ground planes. This method provides a good
RF/thermal-conduction path for the device. Solder the
exposed pad on the bottom of the device package to
the PCB. The MAX19994A evaluation kit can be used as
a reference for board layout. Gerber files are available
upon request at www.maxim-ic.com .
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each V CC pin and
TAPMAIN/TAPDIV with the capacitors shown in the
Typical Application Circuit (see Table 1 for component
values). Place the TAPMAIN/TAPDIV bypass capacitors
to ground within 100 mils of the pin.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX19994A’s 36-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PCB on which the
device is mounted be designed to conduct heat from
the EP. In addition, provide the EP with a low-inductance
path to electrical ground. The EP MUST be soldered to
a ground plane on the PCB, either directly or through an
array of plated via holes.
DESIGNATION
QTY
DESCRIPTION
COMPONENT SUPPLIER
39pF microwave capacitors (0402)
C1, C8
2
1.8pF for Extended RF Band applications
Murata Electronics North America, Inc.
(f RF = 1.7GHz to 2GHz)
C2, C7, C14, C16
C3, C6
C4, C5
C9, C13, C15,
C17, C18
C10, C11, C12,
C19, C20, C21
L1, L2, L4, L5
4
2
2
5
6
4
39pF microwave capacitors (0402)
0.033 F F microwave capacitors (0603)
Not used
0.01 F F microwave capacitors (0402)
150pF microwave capacitors (0603)
120nH wire-wound, high-Q inductors (0805)
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
Coilcraft, Inc.
10nH wire-wound, high-Q inductors (0603). Smaller
L3, L6
2
values or a 0 I resistor can be used at the expense of
some LO leakage at the IF port and RF-to-IF isolation
Coilcraft, Inc.
performance loss.
L7, L8
2
4.7nH inductor (0603). Installed for Extended RF Band
applications only (1.7GHz to 2GHz).
TOKO America, Inc.
25
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